Double-sided FPC
Features
 □ Enables high-speed transmission with low loss at the rate of at
least 1 Gpbs.
□ Possible to make a highly noise-resistant FPC with double layers
provided.
□ Incorporating a microstrip structure, thus ensuring exact
impedance matching.
□ Possible to provide applications integrated with high-speed
transmission connectors.
Basic structure
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Material |
Thickness |
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| 1 |
Coverlay |
Polyimide |
12.5 μm, 25 μm |
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| 2 |
Adhesive layer |
Epoxy |
15 μm, 25 μm |
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| 3 |
Conductor layer |
Copper foil |
12 μm, 18 μm |
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| 4 |
Insulating layer |
Liquid crystal polymer |
25 μm, 50 μm |
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| 5 |
Interlayer connection section |
Ag paste |
- |
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Material |
Thickness |
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| 1 |
Solder resist layer |
- |
20.0 μm |
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| 2 |
Conductor layer |
Copper foil |
12μm, 18μm |
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| 3 |
Insulating layer |
Liquid crystal polymer |
25μm, 50μm |
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| 4 |
Interlayer connection section |
Ag paste |
- |
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Use
□ Components for high-speed transmission at the rate of at least 1 Gbps
□ Components that need countermeasures against static electricity inside the equipment
□ Components that require EMI and MEC countermeasures
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